FIB-X offers focused ion beam contract services.  FIB-X is comprised of dedicated individuals with over 30 years’ experience in the art of FIB nano-fabrication.  FIB-X is constantly developing new techniques and expanding the knowledge base that is necessary for high yield design modifications in an ever increasingly difficult field.

Gel-Pak develops and manufactures a family of elastomer-based carriers and films designed to provide maximum protection during the shipping, handling, and processing of delicate devices. Our manufacturing expertise allows us to customize existing products or rapidly develop novel solutions to meet evolving requirements for next generation technology

Maury Microwave provides calibration, measurement, and modeling solutions supporting RF through sub-THz applications. Offerings include calibration and calibration-validation systems, impedance tuners, measurement accessories, advanced instrumentation for noise generation, RF synthesis, power measurement, phase noise analysis, and channel emulation, along with modeling software and data-analysis tools, all designed to ensure accurate, repeatable measurement results across the development lifecycle.

The MPI Thermal Cycling Test Systems provide precise thermal forcing and temperature testing capabilities for electronic and non-electronic components.

The AST division is proud to offer outstanding Engineering Probe Systems and RF Probes products, global service, and superior application support with unsurpassed values.

Microtech Laboratories, LLC is a leading provider of contract services for failure analysis, component analysis, PCBA analysis and design debug. Our services include FIB, SEM, EDX, PEM/EMMI, Liquid Crystal, X-ray, SAM, Reverse Engineering-Construction Analysis and others such as decapsulation, and cross-section.

Nordson offers state-of-the-art automated optical, microelectronics and solder paste inspection systems.  These provide our customers with fast, accurate inspection they can count on. Our ongoing mission is to offer the most advanced AOI solutions in the industry, while providing excellence in customer service and support.

PVA Tepla OKOS offers Scanning Acoustic Microscopy & Industrial Ultrasonic NDT Systems

PVA TePla’s plasma group specializes in plasma surface treatment technologies, offering systems for surface activation, functionalization, ultra-fine cleaning, coating, ashing, and etching — primarily serving the semiconductor and electronics industries . Key applications include cleaning bond surfaces prior to wire bonding, lead frame activation, photoresist removal and de-scum in wafer lithography. The plasma systems are offered in various configurations — including batch, manual single wafer, and automated single wafer configurations.

XYZTEC bond testers provide industry-leading precision in shear, pull, and advanced bond testing applications. With high-resolution force measurement, automated test routines, and robust data analysis, they enable manufacturers to optimize processes, improve yield, and meet stringent reliability standards from development through production.