ULTRA TEC designs, manufactures and provides advanced surface & sample preparation equipment and consumables for both routine and custom applications in a multitude of industrial settings. We offer solutions for development, analytical and research environments, right up to production.
Surface & Sample Preparation Equipment
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Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation.
ENABLING THE NEXT GENERATION OF FAILURE ANALYSIS
Ever since the inception of the ASAP-1 Project, ULTRA TEC’s goal has been to offer both user-friendly and sample-friendly tools. The ASAP-1® analog systems offer elegant, intuitive controls which have enabled all labs to achieve quality results for subsequent analysis with Photon emission microscopes, laser/ thermal stimulus microscopes and FIB’s. The user-friendly intutive nature of the analog units has been carried forward, and expanded with ASAP-1® IPS.
DIGITAL CONTROL…DONE RIGHT!
ASAP-1® IPS offers deep sub-micron control on X, Y and Z axes, making it ‘hands-down’ the most accurate system ever seen in the market.
MUCH MORE THAN A MILL
ASAP-1® IPS enhances the market-leading attributes of our legacy products with the latest digital technology. It is now possible to grind substrates thinner, polish flatter and de-process even more accurately. ASAP-1® IPS introduces a suite of features that automate many aspects of the process – from analyzing the part to be processed, to writing intuitive programmable recipes, to reading in-situ end-stop indicators that ensure each important sample is prepared correctly. The patented ‘float down’ polishing head design is retained offering the means for producing the quality of final polish demanded by customers for backside microscopy.
IMPROVED SYSTEM CONTROLS
A dedicated machine-vision monitor provides a realtime view of the part, overlaid with current system coordinates and parameter. Now you can see the part as it is being processed!
.A touchscreen interface, a physical joystick and encoders — alongside a suite of intuitive software and hardware — empowers the FA technician & engineering professional for the next generation of failure analysis.
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Since product launch of the original hardware, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation.
In recent years, driven by exponential growth of newer packaging types; CSP, MCM, BGA, flip chip to name a few; in addition to ever more demanding analytical methods, ASAP-1®‘s application array has been expanded to enable mechanical decapsulation and topside de-processing.
The 2nd Generation ASAP-1® models provide the same intelligent engineering approach and intuitive user interface, whilst incorporating advanced optical sample alignment and high torque motor options to handle the most ‘difficult’ sample preparations. Aesthetics and system access have also bee in proved to enhance the ease of use.
OPTICAL ALIGNMENT
Our patented ULTRACOLLIMATOR technology allows for fast, accurate and repeatable parallel alignment of the sample surfaces to the preparation system. Since the ULTRACOLLIMATOR LASER beam aligns directly to the die, there is no guesswork or the need to use mechanical indicators. Transfer to and from the microscope is made fast and accurate. Any small realignments can be made quickly and accurately.
ACCURATE, INTUITIVE SAMPLE POSITIONING
ASAP-1® incorporates controls to achieve the alignment and processing of all sizes packages and samples – from sub-mm die / FIB trenches, right up to large flip-chip CPU modules. The system provides X-Y amplitude control — providing up to 1 inch (25.4mm) maximum cavity size, or an optional 2 inch (50mm) amplitude upgrade, for large large dice and cavities.
The X-Y Independent table movement is now fitted as standard, allowing for single axis trenching and improved angular alignment. ASAP-1®‘s tilt table is maintained, allowing for ‘in package’ tilt to be accommodated, along with the ability to translate the ULTRACOLLIMATOR signal into fast accurate sample alignment.
Recent upgrades to the tool drive include the option for a 3X torque motor, providing the power required to optimize heavy milling and material removal.
ADVANCED, IMPROVED SYSTEM CONTROLS
The new ASAP-1® models incorporate upgraded controls – including process timer and improved traveling table and motor control. Independent Table Drive Switching, the optional LCD monitor and ULTRACOLLIMATOR are all controlled from the front panel of the unit. The LCD monitor is switchable between ULTRACOLLIMATOR and MACRO-VISION modes.
The MACRO-VISION camera provides important realtime feedback to the operator, with a magnified view of the sample surface being de-processed, polished or decapsulated.
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Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-corrosive gas and uses mass flow controllers with precise gas mixing. This is important to achieve selectivity and other issues and other issues requiring attention in the de-passivation of devices.
FA-2000 offers leading edge perfomance in:
Failure Analysis for Semiconductors
- Passivation removal – Isotropic polyimide removal, anisotropic or isotropic silicon nitride removal
- Removal of interlayer dielectrics – packages and 150 mm or 200 mm wafers accommodated
- Unsurpassed tabletop performance in single wafer cleaning, stripping, etching or reverse sputteringOther Applications
- Research and development
- Manufacture of wafer probe cards
- Patterning and trenching in various materials
- Material sciences
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For more information on ULTRA TEC products, Click Here.
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